Cable Preparation Tools

ORACL (peelable semiconductor)

ORACL peelable-semiconductor tool. Cable diameter 10–100mm. Cutting depth 0.4/0.6/0.9/1.1mm fixed; options provided. L135×W55×H35mm, 160g.

Specifications

Cable diameter	Cutting/blade depth	Dimensions & weight
10–100mm	0.4/0.6/0.9/1.1mm fixed, options provided	L135×W55×H35mm, 160g

Contact

Townsville · Sydney · Melbourne