Cable Preparation Tools
MF1/+25 (bonded semiconductor)
MF1/+25 bonded-semiconductor tool. Cable diameter 14–44mm. Cutting depth 1.4mm, adjustable.
Enquire about this productSpecifications
| Cable diameter | Cutting/blade depth | Dimensions & weight |
|---|---|---|
| 14–44mm | 1.4mm, adjustable | not given |
