Cable Preparation Tools
CWB/18-60-MVS (bonded semiconductor)
CWB/18-60-MVS bonded-semiconductor tool. Cable diameter 18–60mm. Cutting depth 1.8mm. L198×W126×H73mm, 730g.
Enquire about this productSpecifications
| Cable diameter | Cutting/blade depth | Dimensions & weight |
|---|---|---|
| 18–60mm | 1.8mm | L198×W126×H73mm, 730g |
